Quantum Motion raised $160m to support commercialization of its silicon-based quantum computing technology
Round was co-led by DCVC and Kembara, with participation from new investors British Business Bank and Firgun
Round was co-led by DCVC and Kembara, with participation from new investors British Business Bank and Firgun
Chip giant also said customer demand for its new Arm AGI CPU has hit $2bn
McLean has previously worked at Analog Devices, Texas Instruments, and National Semiconductor
Highest capacity commercially available SSD
Despite significant double-digit data center growth, total revenue remained flat quarter-on-quarter
Company’s shares surged by more than 15 percent to push it past the $1tn mark
Investors in the Series B round included Intel Capital, IQT, and ETF Partners
System’s compute performance is expected to exceed 25 petaflops
Company says acquisition will boost its AI and data center product offerings
Chipmaker has also hired former Qualcomm exec Alex Katouzian to oversee its Client Computing & Physical AI Group
Fractile’s hardware not expected to be available until 2027
Company is forecasting $12bn worth of sales
Initial shipments of the chips expected in December
The LineShine system will comprise entirely of Chinese-made hardware
Record-breaking growth primarily driven by memory demand
Chipmaker netted $231m from sale of its remaining stake in British chip designer this week
Technology Secretary Liz Kendall said she will not accept “defeatism” that the hardware race has already been won by the US and Taiwan
Startup designs custom application-specific photonic chips
First enterprise quantum deployment in the country
System will form part of the IT4LIA AI factory, hosted and operated by CINECA at the DAMA Tecnopolo of Bologna
Social media giant says it will deploy “tens of millions” of Graviton5 cores in support of agentic AI workloads
Shares in the company rose 20 percent after results were published
The rally foreshadows 18 days of planned strike action set to take place in May
Chipmaker says all its announced technologies will be manufactured without the need of high-NA EUV tools