Schneider Electric has signed a partnership to sell Chilldyne's direct to chip liquid cooling systems.
The power and cooling giant will offer Chilldyne's negative pressure liquid cooling system, offering worldwide sales and support on the patented products. The products will sit alongside Schneider's existing Uniflair cooling and chilling products.
Chilldyne has patents on "negative pressure" liquid cooling technology, which uses a low flow-rate and low pressure, so if there is a leak, the fluid moves away from the electronics rather than leaking. This leak-proof approach to direct-to-chip cooling can handle high-temperature chips and GPUs with low risk, the company says.
Schneider Electric Director of Cooling Innovation and Strategy, Maurizio Frizziero said: "Schneider Electric’s partnership with Chilldyne will allow our customers to implement next-generation liquid cooling, while making their data centers more energy-efficient and less vulnerable to downtime.”
Chilldyne CEO, Steve Harrington said: “Our goal is to reduce data center energy consumption with worry-free, maximum uptime cooling."
Options for cooling have become more diverse as densities have increased, but liquid cooling has become more of a mainstream activity, with the Open Compute Project launching standard packing options for liquid cooling in data centers. Last week's OCP summit saw new liquid cooling options from LiquidStack and Vertiv.
