DXN, an Australian manufacturer of containerized data centers, has launched a liquid-cooled module.
The company this week announced the launch of a high-performance computing (HPC) AI direct-to-chip liquid cooling pod.
The modules are available in 1MW or 2MW designs and can be connected to other modules up to 10MW or 20MW. The direct-to-chip cooling pods can support up to 100kW or 200kW per rack.
The pods can be configured with a centralized cooling distribution unit (CDU) or in-rack depending on customer needs.
DXN has previously delivered dozens of containerized modules to customers including AngloAmerican, gold-miner Newcrest to a site in New South Wales, as well as Boeing, Covalent Lithium, and Pilbara Minerals in Western Australia.
DXN has previously delivered a landing station module to Sub.co on the Cocos (Keeling) Islands for the Oman – Australia Cable, and to the island of Palau for the Meta/Google-led Echo subsea cable. It recently signed a deal to deliver another landing station to Timor-Leste.