DCD Magazine #62 - The coming wave
Will compute at sea sink or swim?
News - IT Hardware & Semiconductors
The latest news from the AI, data center, telco, chip, and cloud sector
DCD Magazine #62 out now
-
NTT deploys Nvidia GPU test cluster at Munich 2 data center
Allows customers to test AI applications on Nvidia Blackwell hardware
-
D-Wave delivers Advantage2 quantum computer to Italy
System has been funded by SQT and will support the region's quantum computing ambitions
-
Two workers killed, third injured, in explosion at Intel’s Kiryat Gat fab in Israel
Company says it is cooperating with authorities on investigation into incident
-
Nvidia joins The Earthshot Prize as new founding member
Will provide finalists with resources and compute to scale technology
-
Celestica debuts liquid-cooled CPO switch for AI fabrics
DS6005 targets AI network efficiency through Broadcom switch silicon
-
Photonics quantum firm Orca Computing deploys PT-3 system at Digital Realty’s LHR19 data center
Quantum computer was installed and operational within 24 hours, and is already powering two projects
-
GlobalFoundries to build and operate two new chip fabs in NY as part of $21bn US-Japan deal
First facility is expected to be operational in 2029
-
Credo pushes past copper limits with 1.6T optical cable
ZeroFlap ALC looks to bring copper-class reliability to AI scale-out networks
-
Microchip Technology updates its networking and storage products to better support AI and HPC workloads
Expanded data center portfolio will help customers address multiple infrastructure challenges, the company said
-
Meta details next-gen AI infra: Custom multiterabit switches & unified fabrics
OCP provides a glimpse at the stack set to power Muse agent workloads
-
Microsoft unveils Azure Maia 300, says chip will be its “primary inference system”
Meanwhile, Maia 200 has already been deployed across multiple geographies
-
Nvidia opens up Vera Rubin rack and tray designs to OCP
MGX 1.2 spec doubles down on liquid cooling
-
Nvidia gears up to smash CPU hegemony as Vera starts shipping
Dedicated ‘discrete’ processor platform segregates agentic workloads from NVL72 to boost performance
-
Meta builds custom 'IceCube' AI network switch using Nvidia's Spectrum-6 ASICs
Switch pairs FBOSS OS with 102T chip for 100K+ GPU clusters
-
Supermicro contractor Ting-Wei “Willy” Sun pleads guilty to four counts associated with Nvidia chip smuggling charges
Charges include conspiracies to violate export controls, smuggle goods, defraud the US, and obstruct justice
-
AMD unveils Helion rack to support agentic AI workloads
Company says rack is customizable, with CPU-only version available
-
Photonic quantum startup Quanfluence raises $10m for full-stack architecture development
Bengaluru-based company is designing and developing its own photonic quantum hardware
-
Oratomic raises $775m for development of fault-tolerant quantum computer
Pasadena-based startup emerged from stealth in March 2026
-
Report: Nvidia plans to invest in inference chip startup d-Matrix
Follows reports that company was seeking to raise additional funds, targeting $5bn valuation
-
GlobalFoundries signs $2bn, five-year deal with TSMC for production of advanced packaging components
GF’s Malta, NY, fab will become first US source for supply of silicon interposers
-
Oracle, Broadcom, and SpaceX looking to secure ten of billions in financing to support AI compute purchases – report
Broadcom is seeking $50bn, while SpaceX is looking to secure $40bn
-
Wolfspeed receives $1.5bn conditional loan commitment from US gov’t to boost domestic SiC and GaN production
Financing will also help advance a number of DoD initiatives
-
HPE launches four new AMD-powered servers as part of its ProLiant Gen13 portfolio
Will expand compute, memory, and I/O capabilities across a number of different workloads
-
Intel and Applied Materials to collaborate on chip manufacturing advancements
Work will take place at the companies' respective R&D facilities
-
Japanese chipmaker Rapidus to establish CORE initiative to support semiconductor design and manufacturing
First phase will see launch of Design Solution Associates project
-
Germany’s Karlsruhe Institute of Technology unveils 33 petaflops HoreKa 2 supercomputer
Hybrid system powered by AMD Turin CPUs and Nvidia GB200 GPUs
-
Qualcomm and Huawei sign multi-year patent license agreement spanning 5G, compute, AI, and networking technologies
Financial terms of the agreement have not been disclosed
-
Elon Musk confirms TeraFab discussions between SpaceX and TSMC, says SpaceXAI will be renamed SpaceXSI
Follows reports that TSMC is mulling over plans for a chip manufacturing hub in Texas