GlobalFoundries has entered into a $2 billion, multi-year manufacturing agreement with TSMC to secure the supply of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem in the US.

Under the terms of the deal, GF will provide manufacturing services to TSMC and add capacity at its fab in Malta, New York, to establish the site as the first US base for the production of silicon interposers – thin pieces of silicon containing vertical channels, also known as through-silicon vias (TSVs), that support 3D stacking on silicon wafers.

GF said the agreement has an initial term of five years and provides a framework for future capacity expansion. Volume production is expected to begin ramping at the Malta site during the first half of 2028.

“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” said Ed Kaste, SVP of CMOS business at GF. “By providing manufacturing services using GF’s trusted US manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”