Samsung Electronics workers in South Korea vote in favor of strike action in May
Walkout comes almost two years after union carried out first-ever strike in company’s history
Walkout comes almost two years after union carried out first-ever strike in company’s history
One of the defendants is a co-founder of the server manufacturer
SpecQtrum will give users access to the company’s data center in Barcelona, Spain
Swiss company develops electronics capable of operating in cryogenic environments
Three publicly traded quantum computing companies will soon be joined on the stock market by a host of competitors
Project supports research into hybrid digital-analog architectures in HPC environments
At time of deployment, system functioned as pilot for future direct cooling concepts
Facility is South Korea’s first commercial quantum computing center
Agreement with see Samsung supply AMD with HBM4 and DDR5 RAM for its forthcoming GPUs and CPUs
System expected to be operational in the latter half of 2026
AMD-powered system will deliver 6.76 exaflops of AI compute power when deployed
Comes as UK gov’t announces £1bn quantum fund to help retain homegrown talent
Will be deployed on Amazon Bedrock in AWS data centers
Announcements made at company’s annual Converge conference in California
Project Optimism could help close supply chain gaps and develop expertise
The 20-qubit Aalto Q20 system will be operated by Aalto University
Rack-scale infrastructure will overcome constraints of traditional copper interconnects
Reference architecture maps path for solving scientific challenge no single compute approach is capable of
Will also establish a quantum innovation center
Launches aimed at supporting transition towards multi-rack scale-up and high-bandwidth scale-out in AI data centers
Designed to support generative AI workloads, the MTIA 300, 400, 450, and 500 will all be deployed by 2027
SK Hynix has become a founding partner of the EPIC Center, slated to open later this year
The MCUs are integrated with company’s TinyEngine NPU to speed up processing and cut energy use
Forthcoming PIC100 TSV platform will support both near- and co-packaged optics