Engineering thermal resilience for next-gen workloads

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  • The Compute, Storage & Networking Channel
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As power densities skyrocket, next-generation cooling technologies must step up to prevent performance throttling and efficiency losses. Discover the changing requirements beyond general trends and explore what large colos/cloud providers are demanding versus what enterprise operators are prioritizing, from space, budget, to regulatory constraints.This discussion will explore:

  • Hybrid cooling strategies for AI from liquid and air to immersion
  • Advanced fluid cooling techniques - direct-to-chip vs. immersion cooling
  • The rise of AI-optimized thermal monitoring and automation
  • Partnership-driven innovation: How to co-design solutions with chipmakers

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