Gen-Z Consortium is an industry organization developing an open-systems interconnect designed to provide high-speed, low-latency, memory-semantic access to data and devices. Launched in 2016, by AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx, the Consortium has since grown to over 60 members. In 2018, the Consortium released its Core Specification 1.0, which enables silicon providers and IP developers to begin developing products enabling Gen-Z technology solutions. The Consortium currently has nine final and two draft specifications available for public download on its website,

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