Samsung Electronics will invest 40 billion yen ($280m) over five years to build a research facility focused on advanced chip packaging in Japan.
In a statement reported by Reuters, the Japanese government said it will provide Samsung with subsidies worth up to 20 billion yen ($141m) in what is part of an ongoing effort to boost Japan's semiconductor industry.
Earlier this week, Japan’s new industry minister reaffirmed the government’s commitment to supporting chip manufacturing in the region, saying he wanted to continue the work of his predecessor.
According to an announcement made by the city of Yokohama, where the facility will be based, the site will allow Samsung to partner with packaging-related companies that are based in the region, with the head of Samsung Electronics co-CEO Kyung Kye-hyun adding it will enable the company to “strengthen its leadership in chips.”
In May, Samsung Electronics announced plans to build a supercomputer over the next five years using solely memory chips. The news came a year after the company launched a supercomputing center at its Advanced Institute of Technology in Suwon, South Korea.
