Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore.

The company announced the investment on the same day it broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in the city-state.

Micron said the advanced packaging facility would "further strengthen Singapore’s local semiconductor ecosystem and innovation,” noting that it would also be the first of its kind in Singapore.

The fab, which is located next to the company’s current facilities, will also feature greenhouse gas abatement, water recycling, and waste circularity to align with Micron’s sustainability commitments.

Operations at the site are scheduled to begin in 2026, with the company’s expansion plans also intended to support the long-term manufacturing requirements for NAND. Micron said that over the course of the investment period, an initial 1,400 jobs would be created, largely in packaging development, assembly, and test operations. This number could rise to 3,000 as the site continues to expand.

“As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,” said Sanjay Mehrotra, president and CEO of Micron. “With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.”

Micron already has a large operational footprint in Singapore, which includes three 3D NAAN plants – 10N, 10X, and 10A.