Arm releases first public specification of its Chiplet System Architecture
Aims to provide industry standardization for chiplet compatibility
Aims to provide industry standardization for chiplet compatibility
Slated to open later this year
Based on company’s heat-assisted magnetic recording technology
Earthquake hit southern Taiwan just after midnight
Both companies have previously been tied to silicon photonics projects
Center described as the “first of is kind”
The first of two systems ordered by the university
The four funding packages will support the expansion and modernization of multiple facilities
Financial terms have not been disclosed
Restricted companies accused of posing a risk to US national security
Consortium now has more than 65 members
Deal saw company valued at $1.2bn
Fund will start operating independently under a new name in the latter part of 2025
The UK’s CMA has indicated the agreement now satisfies its conditions
Job postings reveal company is developing a “server solution for data center applications”
Will seek to prohibit access to advanced AI chips and AI model weights
Arizona chips on par with those being produced in Taiwan
Beat Dell and Supermicro for the contract
Americas saw biggest YoY growth, while demand in Europe was down
Broke ground on a new HBM advanced packaging facility
Total 2024 revenue highest reported by the company in 30 years
Almost a year since spinout was first announced
SoftBank first expressed interest in the chipmaker back in 2021
Claims the company’s GPUs have seen a 1,000x improvement over the last decade