GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

Describing the center as “the first of its kind,” the company said the new facility would allow semiconductors to be “securely manufactured, processed, packaged, and tested entirely onshore in the United States.”

GlobalFoundries
– GlobalFoundries

In a statement, GF said the AI boom had led to a growing need for silicon photonics and 3D and heterogeneously integrated (HI) chips to meet power, bandwidth, and density requirements in data centers and Edge devices.

To meet these needs, the company said its new Advanced Packaging and Photonics Center will offer advanced packaging, assembly, and testing for GF’s differentiated silicon photonics platform; full turnkey advanced packaging, bump, assembly, and testing for aerospace and defense customers; and new production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and HI chips using GF’s 12LP+, 22FDX, and other platforms.

Earlier this month, GlobalFoundries announced it had partnered with Quantum Motion to develop quantum processors fabricated on GF’s 300mm 22FDX platform.

The new center is "a direct response to our customers asking for more geodiversity in their supply chains and additional support with advanced packaging solutions for GF silicon photonics, Trusted, and 3D/HI offerings,” said Dr. Thomas Caulfield, president and CEO of GF. “The New York Advanced Packaging and Photonics Center will be unique in our industry and will play a vital role in the continued growth of the Empire State’s world-class semiconductor manufacturing and innovation ecosystem.”

GlobalFoundries is expected to invest $575 million in the project, with an additional $186 million slated to be spent on research and development over the next decade. The state of New York will provide up to $20 million in new support for the center, while the Department of Commerce has awarded the company $75 million in direct funding, supplementing the previously announced GF award under the CHIPS and Science Act.

In November 2024, GF finalized the negotiations for its CHIPS and Science Act funding, under which it will receive $1.5 billion in direct funding to expand its manufacturing capabilities in New York and Vermont. The following month, the company was awarded an additional $9.5 million in US federal government funding to advance the manufacturing of gallium nitride-on-silicon (GaN-on-Si) chips at its fab in Essex Junction, Vermont.

The semiconductor manufacturer has also previously been awarded more than $550 million in support from the New York State Green CHIPS Program, which will be used to expand the company’s Malta campus in the state.