End-to-end system design for high-density AI

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  • The Data Center Cooling Channel
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AI workloads are forcing a fundamental rethink of how data centers are designed. Power, cooling, and compute must now be planned as a single integrated system: from chip-level heat collection through to facility-wide heat rejection and reuse. This session examines the design principles, architectural decisions, and controls for building facilities that can scale with AI. We will discuss:

  • Full thermal chain design from rack heat collection through to heat rejection and reuse, and why a gap anywhere in the chain creates risk
  • Grid versus BYOP&C as a capacity unlock, not a grid workaround, and why controls determine whether it delivers value
  • Digital twins as a core engineering methodology, from pre-build simulation through to closed-loop optimization in live operations

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