Scale Across and the next era of AI interconnect
– EDT
Speakers: Vlad-Gabriel Anghel, Nilson Gabela
The path from a single AI cluster to a distributed AI ecosystem is creating new connectivity challenges at every stage of deployment. Networks must support larger-scale builds, accommodate increasing density within the rack, and connect AI resources across campuses and regions without compromising efficiency or reliability.
Join us for this three-part series as we explore how Corning’s fiber and optical connectivity solutions are evolving to meet the demands of each stage of that journey.