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Increasing density within the rack introduces a different class of connectivity challenge than scaling across multiple racks. Rather than extending connectivity across rows of racks, it concentrates compute and optical interconnects within a much smaller physical footprint, where connector access becomes increasingly restricted. In these environments, traditional approaches to connecting fiber are being re-evaluated, including how technologies like Corning’s PRIZM connector can better support the next generation of AI systems

This session will explore:

• Why Scale Up introduces a different set of connectivity challenges than Scale Out architectures
• How limited connector access is influencing the design of high-density AI systems
• How PRIZM connector technology and blind-mate, lens-based optical connectivity supports dense rack environments
• How connector technologies are evolving to simplify installation and reduce operational intervention