Peter de Bock
Vice President Data Center Energy & Cooling, EatonDr. Peter de Bock serves in Eaton's CTO Office, where he leads strategic initiatives for Eaton's data center technology roadmap. His work focuses on next-generation AI infrastructure, including power distribution, liquid cooling, digital engineering, system engineering, and technology partnerships that enable the industry's transition to higher-density data centers.
Previously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E agency, where he architected, and managed the COOLERCHIPS program, a breakthrough initiative establishing the technical foundation for hot-water–cooled data centers. He also led the ASCEND program, pioneering Megawatt class power architectures. Prior to ARPA-E, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems.
He holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente, and is an ASME Fellow, IEEE Senior Member and holds 68 patents and applications.
