Paul Artman
Fellow System Design, AMDPaul Artman is a Fellow in System Design Engineering in the Data Center System Group at AMD.
In this role, Paul is involved in hardware design and with a focus on emerging hardware architectures and technologies with a focus on enabling and scaling the industry on power and cooling. Paul has 20+ years of experience in thermal, power, and hardware packaging at AMD, Lenovo, Dell, and HPE. Paul was a founding member of ASHRAE TC9.9 (Mission Critical Facilities, Data Centers, Technology Spaces and Electronic Equipment), and he has contributed to the definition of both air-cooling and direct liquid cooling data center specifications and white papers. Paul Artman is an active participant in several OCP workgroups.