Berhanu Wondimu

Mechanical/Thermal Engineer, Intel Corp

Berhanu Wondimu is a Mechanical/Thermal Engineer at Intel Corporation in the Datacenter & AI group. Berhanu joined Intel in 2018 and has been working on liquid cooling technology for data center product applications. Before joining Intel, Berhanu worked for Flowserve and Dover Corporation for over eight years as a research and product development engineer, designing pumps, valves, mechanical seals, and control systems for various fluid flow applications. Berhanu holds an MSc in Mechanical Engineering from San Diego State University and has several issued patents and publications.