nVent has launched a new modular data center liquid cooling solution, which it says is ready to meet the demands of current and future AI chips.

The new range of products includes enhanced coolant distribution unit (CDU) offerings with new row and rack-based CDU, alongside advanced technology cooling system manifolds.

“We are tapping into our deep technical expertise, and working collaboratively with chip manufacturers and the broader ecosystem, to solve our customers’ unique challenges with these new liquid cooling and power solutions,” said Eric Osborn, general manager of nVent Data Solutions. “Our commitment to leading innovation for next-generation AI chips is at the core of the work we have done in the space for more than a decade.”

As well as modular and scalable row-based CDUs, nVent’s updated portfolio includes next-generation PDUs, AC and DC rack CDUs, and new technology cooling system (TCS) manifolds.

According to the vendor, “these new solutions bring cutting-edge cooling infrastructure to data centers to support the AI buildout.”

It has also developed a common control platform that it hopes will enhance reliability and improve the user experience for data center operators.

Elsewhere, nVent is one of a number of vendors to have built a CDU inspired by Google’s Project Deschutes, the in-house CDU design developed by the cloud and search giant. Revealed earlier this year, Google has since made the specs of Project Deschutes available to the Open Compute Project community.