A number of data center cooling firms revealed new cooling distribution units (CDU) inspired by Google at the Open Compute Summit in California this week.

Earlier this year, Google detailed the latest generation of its in-house CDU design, codenamed Project Deschutes, which it aims to use in high-density racks.

Google has since released the design and specs of the CDU to the OCP community, and several cooling firms have developed cooling systems built to the search giant’s specifications.

Boyd was one firm exhibiting a Project Deschutes CDU at the summit this week. The company said the new CDU features up to 2MW of cooling at a 3°C (37.4°F) approach temperature difference (ATD), in addition to 80 PSI available pressure to enable advanced cold plate designs to cool future high-power AI processors.

“We’re honored to showcase Google’s Project Deschutes CDU design at the 2025 OCP Summit,” said Jerry Toth, Boyd CTO. “We built this CDU to uniquely meet the demanding specifications set by Google to enable high-performance cooling in advanced AI data centers.”

Data center observer Rich Miller noted that CoolerMaster was also showing off a Deschutes-compliant CDU at OCP this week. ConvergeDigest also noted, Envicool and Nidec were at the event with Deschutes CDUs.

Vertiv’s CoolChip CDU is also built to Google's Project Deschutes 5th-generation OCP specification. Delta, nVent, and Stulz have also developed Deschutes-compliant CDUs.

“Earlier this year, we announced Project Deschutes, a state-of-the-art liquid cooling solution that we contributed to the Open Compute community, and have since published the specification and design collateral,” Google said this week. “The community is responding enthusiastically, with liquid cooling suppliers like Boyd, CoolerMaster, Delta, Envicool, Nidec, nVent, and Vertiv showcasing demos at major events this year, including the OCP Global Summit and SuperComputing 2025.”

But the CDU isn’t the only aspect of the data center Google wants to collaborate with industry on, saying it wants to develop “industry-standard cooling interfaces, new components like rear-door-heat exchangers, reliability, etc.”

“One particularly important area is standardizing layouts and fit-out scopes across colos and third-party data centers, so we as an industry can enable more fungibility,” Google added. “We need to bring together compute, networking, and storage in the server hall, including physical attributes of the data center design such as rack height, width, and depth (and more recently, weight); aisle widths and layouts; as well as rack and network interfaces. We also need standards for telemetry and mechatronics to build and maintain these future data centers.”