Archived Content

The following content is from an older version of this website, and may not display correctly.

In one of the biggest advancements in fundamental transistor design, Intel Corporation has revealed that it is using two dramatically new materials to build the insulating walls and switching gates of its 45 nanometer (nm) transistors. Hundreds of millions of these microscopic transistors - or switches - will be inside the next generation Intel┬« CoreÔäó 2 Duo, Intel Core 2 Quad and Xeon┬« families of multi-core processors. The company also said it has five early-version products up and running - the first of fifteen 45nm processor products planned from Intel.
The transistor feat allows the company to continue delivering record-breaking PC, laptop and server processor speeds, while reducing the amount of electrical leakage from transistors that can hamper chip and PC design, size, power consumption, noise and costs. It also ensures Moore's Law, a high-tech industry axiom that transistor counts double about every two years, thrives well into the next decade.
Intel is the first to implement an innovative combination of new materials that drastically reduces transistor leakage and increases performance in its 45nm process technology. The company will use a new material with a property called high-k, for the transistor gate dielectric, and a new combination of metal materials for the transistor gate electrode.
"The implementation of high-k and metal materials marks the biggest change in transistor technology since the introduction of polysilicon gate MOS transistors in the late 1960s," said Intel co-founder Gordon Moore.
Transistors are tiny switches that process the ones and zeroes of the digital world. The gate turns the transistor on and off and the gate dielectric is an insulator underneath it that separates it from the channel where current flows. The combination of the metal gates and the high-k gate dielectric leads to transistors with very low current leakage and record high performance.
"As more and more transistors are packed onto a single piece of silicon, the industry continues to research current leakage reduction solutions," said Mark Bohr, Intel senior fellow. "Meanwhile our engineers and designers have achieved a remarkable accomplishment that ensures the leadership of Intel products and innovation. Our implementation of novel high-k and metal gate transistors for our 45nm process technology will help Intel deliver even faster, more energy efficient multi-core products that build upon our successful Intel Core 2 and Xeon family of processors, and extend Moore's Law well into the next decade."

The full version of this press release can be found on:
http://www.intel.com/pressroom/archive/releases/20070128comp.htm

To view the opinion of the Uptime Institute regarding this announcement please register at:
www.upsite.com/symposium/index.html