Nordic data center company DigiPlex has completed a senior secured bond issue of NOK 655 million (US$63m), maturing in May 2023.
The money will be used to finance the construction of two new data centers.
Growing in the Nordics
The company said that the bond issue "was substantially oversubscribed." An application will be made for the bonds to be listed on Oslo Stock Exchange (OSE), with the settlement date expected to be 12 May 2020.
"The strong investor interest and substantial oversubscription of our latest bond issue is a clear testament to the strong credit story and track record of DigiPlex," Byrne Murphy, founder and chairman of DigiPlex, said.
"The market is clearly very receptive to profitable growth, high customer retention, leading market presence and a high-quality management team."
Wiljar Nesse, CEO of DigiPlex, added: "We are seeing increased demand from both our enterprise customers who continue to move their digital infrastructure from on-premise solutions into combinations of colocation and cloud, as well as from the largest IT companies in the world looking to capitalize on the advantages of placing their data centers in the Nordics.
"With this new bond issue completed, our already very strong offering and position will be reinforced even further to capture these exciting market opportunities."
The bond issue follows previous DigiPlex bond issuances - a NOK 1.8 billion ($173m) listing in October 2019, a NOK 575m ($55m) bond in February 2016, and a NOK 500m ($48m) bond in June 2014.