Canadian liquid cooling company CoolIT has signed its largest single order to date, supplying an undisclosed US customer through an OEM partner.

The deal will see CoolIT provide 30,000 Systems Rack DCLC coldplates and supporting manifolds, with the company’s direct contact liquid cooling used to manage heat produced by Intel Xeon Phi processors. CoolIT’s customer would not allow any details to be shared, but each coldplate covers one processor, along with other selected heat sources. It is understood that the deployment will be very dense, perhaps amounting to 200 racks. 

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“The sheer magnitude of this deal reaffirms the global migration towards adopting more energy efficient data center cooling solutions,” Geoff Lyon, CoolIT Systems CEO, said.

“CoolIT continues to be the leading choice for server manufacturers and we are proud to provide our OEM partner with factory-installed liquid cooling to support this major US installation.”

The news comes one day after the company announced a liquid cooling solution to support the Intel Compute Module HNS2600BPB (Buchanan Pass) server, a 2U, four-node appliance that features dual Intel Xeon Scalable processors (Skylake), voltage regulators and memory.

“When Intel approached us to support this server with a high efficiency liquid cooling solution, our team was excited to accept the challenge,” CoolIT’s VP of product marketing, Patrick McGinn, said.

“This tightly integrated solution creates a very dense, energy saving platform that showcases how liquid cooling can be implemented without sacrificing serviceability.”