DCD Magazine #62 - The coming wave
Will compute at sea sink or swim?
Will compute at sea sink or swim?
Follows reports that company was seeking to raise additional funds, targeting $5bn valuation
GF’s Malta, NY, fab will become first US source for supply of silicon interposers
Broadcom is seeking $50bn, while SpaceX is looking to secure $40bn
Financing will also help advance a number of DoD initiatives
Will expand compute, memory, and I/O capabilities across a number of different workloads
Work will take place at the companies' respective R&D facilities
First phase will see launch of Design Solution Associates project
Hybrid system powered by AMD Turin CPUs and Nvidia GB200 GPUs
Financial terms of the agreement have not been disclosed
Follows reports that TSMC is mulling over plans for a chip manufacturing hub in Texas
Will see Cerebras' wafer-scale compute coming to the AI cloud platform
Startup has pivoted away from underwater data centers to harness the power of the sun
Amazon now serving as lead customer for Synopsys’ expanded silicon IP business
Accelerator will be targeted at hyperscalers and CSPs once production begins in 2028
Californian startup raised $145m in Series C funding round
Neocloud also to offer Vera CPU alone, and announces customer contract
AI cloud startup recently secured $300 million in Series B funding round
Calls have a combined budget of €80 million
The companies already operate the platform across two deployments in the Kingdom
Investors include Dell Technologies, J.P. Morgan, and the State of Michigan
World Labs’ CEO will join chip giant as EVP and chief scientist
Students can use the z17 to develop and test AI applications
Company has raised “hundreds of millions” for development of chip with 3D DRAM stacking, report claims
EUV lithography company says its working with politicians to bolster chipmaking efforts across the continent
CEO provides further details regarding expansion plans announced earlier this year
First order of SiPearl’s Rhea1 processors
Singapore-based startup has developed a platform for growing 12-inch single-crystal 2D semiconductor materials
New AI chip slated for release in Q1 2027