As rack densities rise and hardware roadmaps accelerate, Legrand’s experts explain why electrical and thermal infrastructure must be planned together

While industry conversation is heavily focused on direct-to-chip liquid cooling, today’s reality is that most data centers are still operating with air-cooled environments, making airflow management the critical intersection

As chip TDPs and heat flux rise beyond known limits, the viability of conventional cooling is uncertain, positioning two-phase as a stable foundation for ultra-high-density computing