Liquid cooling is no longer a question of if, but how. While both single-phase and two-phase technologies are proving capable of supporting next-generation AI workloads, choosing between them is becoming far more complex than comparing thermal performance alone. Chip architecture, heat distribution, and overall system design all play a critical role in determining which approach delivers the best outcome. This session explores why there may never be a universal answer, and what operators should really be considering when evaluating their cooling strategy. This session will discuss:
- How chip-level heat profiles influence the effectiveness of single-phase and two-phase cooling
- The role of CDU performance and cold plate design in overall system efficiency
- Where each cooling technology offers the greatest advantage for different applications
- Whether the industry is likely to converge on a single cooling architecture or continue adopting multiple approaches for different workloads
