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As co-packaged optics (CPO) move from concept to deployment, glass-based waveguides are emerging as a key technology for enabling scalable, high-bandwidth optical interconnects. With this shift comes new challenges in wafer-level testing, manufacturability, and validation. In this episode, we explore how wafer-level testing of glass-based waveguides is helping ensure performance, yield, and reliability for next-generation CPO architectures and what system designers, optical engineers, and data center operators must consider as adoption accelerates. Join this episode to discover:

• How wafer-level testing enables validation of glass-based waveguides for CPO at scale
• The role of glass waveguide technology in supporting next-generation AI and data center interconnects
• Key manufacturability and reliability considerations for optical I/O integration
• Why ecosystem collaboration is critical to advancing glass-based CPO innovation and deployment