Direct-chip level cooling: CAPEX & OPEX evaluations for legacy data centers repurposed for edge deployments
This session took place on August 4, 2020
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Direct-chip level cooling: CAPEX & OPEX evaluations for legacy data centers repurposed for edge deployments
With the virtualization of applications driving up average density per rack to 15-16kW, it is difficult to forecast how the industry's standard cooling practices will withstand the pressure of next-generation workloads. This presentation will share insight into the cooling methods best able to manage the future trajectory of data center compute.
- Speakers
- David C. Meadows , STULZ
- Brought to You by
- STULZ