The challenge of cooling extremely dense and high-performance infrastructure is a well known problem, but the recent introduction of two-phase, direct-to-chip liquid cooling options may offer a scalable, efficient, and non-disruptive solution for the long-term challenge of heat management.

In this whitepaper, Steven Hill, an independent technology analyst discusses the growing challenge of cooling high-powered chips when factored against power consumption, case temperature, thermal resistance, airflow, and coolant temperatures.

Read this whitepaper to explore:

• The current state of air-cooled data centers
• A return to liquid cooling
• The impact of direct-to-chip liquid cooling