Rising rack power densities are changing how data centers collect, manage and reject heat.

As high-density AI workloads become more common, thermal management must evolve across the entire data center, from the server and rack to facility-level heat rejection and reuse.

This whitepaper from Vertiv examines the interconnected data center thermal chain, exploring the technologies and design considerations needed to manage increasingly complex thermal environments.

Read to discover:

• How air, liquid and hybrid cooling approaches support different rack densities
• The role of direct-to-chip cooling, rear-door heat exchangers and immersion cooling
• How CDUs, manifolds and heat rejection systems connect the thermal chain
• How free cooling, heat reuse, intelligent controls and predictive maintenance can improve efficiency and resilience