AI servers are pushing GPU power densities beyond the limits of conventional cooling, increasing thermal resistance, energy consumption, and the need for colder facility water.
As next-generation chips continue to scale, data center operators require new approaches that can deliver greater cooling performance without compromising efficiency.
This Accelsius whitepaper explores a direct-on-die two-phase cooling approach designed to reduce thermal resistance, improve heat transfer, and support higher facility water temperatures.
Read now to discover:
- How direct-on-die two-phase cooling reduces thermal resistance by eliminating traditional cold plates and thermal interface materials
- A comparison of flow boiling and jet impingement techniques for cooling high-power GPUs
- How higher facility water temperatures can improve energy efficiency and create opportunities for heat reuse
- Key performance findings and design considerations for supporting next-generation AI workloads and future GPU architectures
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