Roger Schmidt

TC 9.9 IT Subcommittee Chair, ASHRAE & Fellow, IBM

Roger R. Schmidt is a Syracuse University Mechanical and Aerospace Engineering Traugott Distinguished Professor, IBM Fellow Emeritus, National Academy of Engineering Member, and ASME Fellow. He has over 37 years’ experience in engineering and engineering management in the thermal design of IBM’s large scale computers. He was IBM’s Chief Engineer on Data Center Energy Efficiency and has led development teams in cooling mainframes, client/servers, parallel processors and test equipment utilizing such cooling mediums as air, water, and refrigerants. He has published more than 125 technical papers and has over 140 patents/patent pending in the area of electronic cooling. He is co-founder and past chair of the ASHRAE TC9.9 committee on Mission Critical Facilities and Data Centers. He is a member of ASME’s Heat Transfer Division and a member of the K-16 Electronic Cooling Committee. He has been an Associate Editor of the Journal of Electronic Packaging, ASHRAE Research Journal and the ASME Journal of Heat Transfer. He has given seminars on electronic cooling and power and cooling trends of IT equipment to a number of organizations around the world.