
OpEx: Minimizing operational expenditure
Strategies for reducing operational expenditure whilst maximizing operational resiliency and efficiency
As Lightmatter’s VP of Engineering, Systems and Packaging, Ritesh leads packaging and systems development for Lightmatter’s next-generation compute and interconnect products. Prior to joining Lightmatter, Ritesh Jain was a Vice President in Intel’s Data Center and AI group where he directed the HW development across silicon packaging, power integrity, signal integrity, mechanical & thermal engineering solutions essential for the data center product roadmap. Over the 2 decades at Intel, Ritesh built and led several cross-functional engineering teams globally and was a part of several major technology transitions and initiatives for datacenter products. He has a Master’s degree in Semiconductor Packaging from the University of Maryland, College Park and a Bachelor’s degree from the Indian Institute of Technology (IIT), Madras.