As Lightmatter’s VP of Engineering, Systems and Packaging, Ritesh leads packaging and systems development for Lightmatter’s next-generation compute and interconnect products. Prior to joining Lightmatter, Ritesh Jain was a Vice President in Intel’s Data Center and AI group where he directed the HW development across silicon packaging, power integrity, signal integrity, mechanical & thermal engineering solutions essential for the data center product roadmap. Over the 2 decades at Intel, Ritesh built and led several cross-functional engineering teams globally and was a part of several major technology transitions and initiatives for datacenter products. He has a Master’s degree in Semiconductor Packaging from the University of Maryland, College Park and a Bachelor’s degree from the Indian Institute of Technology (IIT), Madras.