Synopsys has partnered with Samsung Foundry to expand its portfolio of production-ready, AI-powered EDA tools, certified interface IP, and silicon test capabilities.
According to the companies, these new offerings will allow customers to bring AI and multi-die designs to market faster and with “measurably improved” quality.
The updates were announced during the Samsung Advanced Foundry Ecosystem (SAFE) Forum event, currently taking place in San Jose, California. The partners have also collaborated on new production-ready digital and analog flows, powered by AI, to support third-generation 2nm process nodes.
Other initiatives unveiled during the event include tools containing multiphysics capabilities to support power and performance during signoff; AI-powered tests to improve the efficiency and quality of designs; an expanded IP portfolio that supports both advanced and automotive nodes; and signoff solutions that support 3D multi-die designs.
These collaborations will help customers address compounding chip complexity, increasing costs, and the ongoing need for faster development cycles, Synopsys claimed in a statement.
“As designs become more heterogeneous, customers need production-ready, silicon-proven solutions that address complexity and minimize risk from silicon to systems,” said Ravi Subramanian, chief product management officer at Synopsys. “Our work with Samsung Foundry translates years of design and technology co-optimization and silicon learning into enablement that helps our customers get their advanced designs to market quickly and with confidence.”
Hyung-Ock Kim, VP and head of the Foundry Design Technology Team at Samsung Electronics, added: “Close alignment across design, test, and manufacturing are critical to the success of AI and multi- die designs on advanced nodes. Our continued close collaboration with Synopsys delivers silicon-based, customer-validated solutions that help our customers reduce design integration risk, improve silicon predictability, and move confidently from design to production for their most innovative solutions.”
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