Veir, a US developer of superconducting wires for electrical transmission, has completed its first data center transmission demonstration project.

The company demonstrated that a single low-voltage cable can transmit 3MW of power in a simulated, scalable data center environment.

According to Veir, the system, dubbed Superconducting Technology for AI Racks (STAR), can deliver up to ten times the power and cover more than five times the distance of conventional options, enabling smaller, more flexible data center footprints and faster deployment.

"This demonstration marks a major milestone for Veir and the industry, proving that superconducting power technology can deliver the high-power levels needed in a data center environment, while dramatically reducing the space and weight demanded by traditional systems. Our technology is ready to deploy and provides an immediate solution needed to power the next generation of computing,” said Veir CEO Tim Heidel.

The demonstration project was conducted in a simulated data center environment near Veir’s headquarters in Woburn, Massachusetts.

According to the company, the project effectively demonstrated the commercial readiness of Veir’s technology. The major findings were proof that Veir's technology can be scaled to deliver hundreds of megawatts of power within and around a physical building, demonstrating that its system can carry more than 3MW of power and proving that its STAR system can enable faster time-to-market for data center developers.

"Our integrated team designed STAR from the ground up to solve the high power density and delivery problems emerging in data centers. Using superconducting technology, we are able to move massive amounts of power to maximize performance – safely, reliably, and at scale," said Erhan Karaca, Veir CTO. "This demonstration establishes a clear path to a scalable solution that can be quickly deployed, giving data center architects the flexibility they need for next-gen designs."

Following the successful project, Veir has said it expects to announce the technology's first adopters in the coming months, seeking to achieve full commercialization of the product in 2026.

The company has raised significant funding to support the rollout of its technology. In January, the company secured a $75 million Series B funding round backed by investors including Microsoft.