Nvidia CEO Jensen Huang has teased that the company has “prepared several new chips the world has never seen before.”

Speaking during what was reportedly an unscheduled interview with the Korean Economic Daily, Huang also said Nvidia was planning to unveil “a chip that will surprise people” during the company’s GTC event in San Jose, California, next month.

The conversation occurred after what the CEO described as a “celebration of the world’s best memory [semiconductor] team,” having dined at a Korean fried chicken restaurant in California with engineers from SK Hynix and Nvidia.

He claimed the two companies were “working very closely together” and functioning as “one giant team,” having worked “really hard to meet the great challenge of Vera Rubin and HBM4.”

SK Hynix is the primary supplier of HBM chips to Nvidia, and HBM4 is expected to form part of the GPU maker’s new Rubin architecture, which is set to debut in the latter half of 2026.

In September 2025, SK Hynix claimed its sixth-generation of high-bandwidth memory chips has “the industry’s best data processing speed and power efficiency with the bandwidth doubled… and power efficiency improved by more than 40 percent.

“The company expects to improve AI service performance by up to 69 percent when the product is applied,” it added at the time.

Earlier this year, SK Hynix cautioned that memory chip shortages would likely persist into 2027, with consumer electronics likely to suffer the most in the face of ongoing shortages as capacity will increasingly become allocated to AI infrastructure projects.

The memory chipmaker has previously announced plans to increase its infrastructure investment by more than four times the figure previously disclosed, with the company’s M15X facility in South Korea slated for operation by mid-2027.

While Nvidia’s Huang acknowledged that in the current landscape “nothing is easy because all technologies are at their limits,” he went on to claim that “with a team like this, nothing is impossible.”