Czech modular data center manufacturer ModulEdge has partnered with liquid cooling firm Comino to deliver AI infrastructure across Europe and MENA.

In a statement, the companies said the partnership aims to address the 12-18 months procurement cycles currently facing enterprises looking to deploy AI infrastructure, with their joint solution reducing timelines to between 3-6 months.

The joint solution combines ModulEdge's modular data centers with Comino's liquid-cooled GPU systems, with the latter able to provide Nvidia RTX Pro 6000, H200, B200, B300, and GB300 hardware as part of the offering. Comino’s liquid cooling solution achieves a PUE of 1.05–1.1, the company added.

"Enterprises tell us the same thing: they need AI compute on-site, they need it fast, and they need it without the complexity of managing multiple vendors,” said Alexey Chistov, CTO and co-founder of Comino. “This partnership with ModulEdge lets us deliver exactly that – proven liquid cooling technology inside a deployable, hardened facility that arrives ready to run."

Yuri Milyutin, commercial director and partner at ModulEdge, added: "The AI infrastructure conversation has shifted. Organizations aren't asking whether they need on-premise compute – they're asking how fast they can get it deployed without compromising on security or reliability. Our partnership with Comino answers that question with a proven, deployable solution that doesn't require 18 months of construction and permitting."

Founded in 2023 and based in the Czech Republic, ModulEdge designs and manufactures modular data centers for Edge and on-site high-density compute deployments. Comino, meanwhile, is headquartered in Riga, Latvia, and offers cooling solutions for GPUs, FPGAs, and ASICs based on its proprietary contact-cooling technology.

The partners are currently accepting orders for the offering, with delivery following the 3-6 month timeline outlined in the statement.