Memory chipmaker Micron will break ground on a $100 billion semiconductor fab campus in Onondaga County, New York, on January 16.

Consisting of four fabs when fully built, the so-called megafab is expected to be complete by Q3 2041 and will be the largest semiconductor facility in the US.

Per Micron’s schedule, Fab 1 will be equipment-ready by Q2 2028. Operations at the first facility are slated to begin in early 2029. Fabs 2, 3, and 4 are expected to be operational by late 2030, 2035, and 2041, respectively.

In a statement announcing the forthcoming groundbreaking, Micron said the project represents the “largest private investment in New York state history,” with the campus set to house “the most advanced memory manufacturing in the world.”

Micron executives, including president and CEO Sanjay Mehrotra, will attend the ceremony alongside officials from the Trump administration, members of Congress, and New York state and local government representatives.

“Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States,” said Mehrotra. “I want to thank President Trump, Secretary Lutnick, Administrator Zeldin, Governor Hochul, Senator Schumer, Congressman Mannion, Congresswoman Tenney, County Executive McMahon, and all of our partners in the administration and Congress for their leadership and partnership in getting to this milestone.

“As the global economy enters the AI era, leadership in advanced semiconductors will be the cornerstone of innovation and economic prosperity. Our investments and progress solidify our position as the only United States manufacturer of memory.”

Micron had originally planned to invest around $170bn to boost its chip manufacturing efforts in the US, but announced it was increasing the figure to $200bn in June 2025. At the time, the company said the additional investment would be used to support the construction of a second memory fab in Boise, Idaho, two additional fabs in New York, and the expansion of its manufacturing facility in Manassas, Virginia.

Under the Biden Administration, Micron was awarded $6.165 billion in direct funding as part of the CHIPS and Science Act to support the construction of three new memory chip fabs in Clay, New York, and Boise, Idaho. The company had originally pledged to invest approximately $100bn in New York and $25bn in Idaho, creating approximately 20,000 jobs.

The Department of Commerce said that as a result of the additional investment, a further $275 million in incremental CHIPS Act direct funding has been awarded to Micron.

In December 2025, Micron announced plans to exit the consumer memory and storage market in favor of AI data center customers.