Foxconn and Intel have announced they will be partnering on the development of next-generation AI infrastructure and intelligent compute platforms.

In a statement announcing the collaboration, Foxconn (also known as Hon Hai Technology Group) said it would be combining Intel’s semiconductor technology with its own manufacturing, system integration, and data center deployment capabilities to “accelerate the large-scale deployment of AI-driven technologies across Edge and physical AI applications.”

No financial terms or timeline for the partnership have been detailed, but the partners said the collaboration efforts would span silicon, rack, system, and application layers.

At the rack level, the collaboration will explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon-based CPU racks, AI accelerator architectures, high-speed interconnects, and liquid cooling designs.

Meanwhile, at the Edge and in the physical AI domain, the two companies will work to “jointly define next-generation Edge AI and Physical AI platform architectures,” targeting emerging applications such as agentic AI, Edge intelligence, and robotics.

The partners said they would also explore opportunities for the design and development of custom ASICs, SoCs, and system integration solutions.

“AI is rapidly transforming industries and society worldwide. Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors, and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV, and smart city,” said Young Liu, chairman and CEO of Foxconn. “Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration, and global supply chain capabilities to jointly build next-generation AI infrastructure, Edge AI, and physical AI ecosystems, accelerating the adoption of AI applications worldwide.”

Lip-Bu Tan, Intel CEO, added: “The rapid growth of AI—especially in inference and agentic workloads at scale—is redefining what modern computing must deliver. These demands require innovation across the full stack—from new silicon and chip design to rackscale systems and extending all the way to Edge and physical AI deployments. Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design, rack-scale solutions, and global systems integration. Together, we are accelerating the delivery of end-to-end platforms that unlock new capabilities and extend the impact of AI worldwide.”