Power and cooling technology firm Flex is working with Korean electronics giant LG on a portfolio of liquid and air-cooled data center solutions.

The firms have signed a partnership that they say will bring together Flex's liquid cooling portfolio, proprietary power products, and IT infrastructure solutions with LG's high-performance air and liquid cooling products and thermal management solutions.

By working together, the companies aim to give data center operators “the agility to customize solutions and scale with demand" and meet the needs of the increasingly dense racks found in AI data centers.

Michael Hartung, president and chief commercial officer at Flex, said: "Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center.

“Together, we'll deliver prefabricated, scalable data center infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment, and speed time to revenue for our customers."

The companies will co-develop solutions that will be made available on the Flex AI infrastructure platform, the vendor’s data center platform that integrates power, cooling, compute, and services into modular designs.

"We are advancing our competitiveness in the AI data center market by strategically partnering with leading global companies," said James Lee, president of the LG ES Company. "Our collaboration with Flex adds new momentum to our global expansion and enhances our ability to deliver unique value to clients worldwide."

Formerly known as Flextronics, Texas-based Flex is one of the largest electronics manufacturing services companies in the world, behind Taiwan's Pegatron, with annual revenues of $26.4 billion.

It has ramped up its interest in cooling since acquiring liquid cooling specialist JetCool in November 2024. The company relies on what it calls microconvective direct liquid cooling to cool chips – essentially, instead of passing fluid over a surface, its cooling jets route fluid directly at the surface of a chip.

Last month, Flex and JetCool debuted a modular liquid cooling system, which it says can handle an IT load of up to 1.8MW.

LG has also been expanding its cooling repertoire recently, and in October announced a partnership with SK Enmove and GRC to develop immersion cooling solutions.