ASML has announced that Intel is using its High NA EUV technology to manufacture its Intel Core Ultra Series 3 processors, code-named Panther Lake, built on Intel 18A process node technology.

Intel, which had its first High NA system delivered to its Hillsboro, Oregon, R&D facility in 2024, is using the tool to “pattern specific layers” on the chips, providing ASML and Intel Foundry with helpful data to further refine system setup, uptime, and manufacturing implementation.

“With increased resolution and better process control, the introduction of High NA EUV marks a substantial development in semiconductor lithography,” said Christophe Fouquet, ASML president and CEO. “We are proud to play a role in enabling the smaller, denser patterning that will accelerate advancements in AI and other emerging technologies.”

The news comes as the Dutch lithography toolmaker published its Q2 2026 results, posting net sales of €9.3 billion ($10.6bn) for the three-month period, with net income totaling €2.9 billion ($3.3bn).

ASML sold 86 new lithography systems during the quarter and five used systems, an increase from the 67 new systems but a decrease from the 12 used systems sold in the previous quarter. Following the publication of the results, the company said it expects Q3 2026 total net sales between €11bn and €12bn ($12.5bn and $13.7bn), while full-year net sales are expected to be between €43bn and €45bn ($49bn and $51bn).

Fouquet said that the strength of ASML’s results comes from a “combination of a continuous, very strong demand from our customers but also … our ability to respond to that demand thanks to the strength of our supply chain, manufacturing and the install teams in the field.”

The CEO also said that the company expects to ship around 65 Low NA EUV machines in 2026, a figure that represents EUV business growth of approximately 45 percent. Looking ahead to 2027, Fouquet said ASML was “ pretty much already close” to receiving all the EUV orders it needs – “this is with us adding about 30 percent capacity for EUV in 2027 versus 2026.”

For 2028, Fouquet said that ASML is already exploring an additional 30 percent capacity increase, due, in part, to the “large number of orders from our customers for EUV” that it has already received.

"Ongoing AI-related investments and continued progress in AI technologies are driving demand for advanced logic and memory chips, further strengthening the semiconductor industry's growth outlook,” said Fouquet. “Our customers, in turn, continue to accelerate their capacity expansion plans. This is translating into customer commitments across our product portfolio, providing ASML with increased visibility into longer-term demand.”