AMD has partnered with semiconductor system IP company Arteris to improve chiplet design using the latter’s FlexGen Network-on-Chip interconnect IP.

According to the two companies, AMD has licensed Arteris’ FlexGen NoC IP technology to support the development of its next generation of AI chiplets.

The chip company plans to incorporate FlexGen IP with its Infinity Fabric interconnect to provide high-performance data transport across AMD’s portfolio of data center, Edge, and end device offerings.

Arteris’ NoC IP technology has been designed to optimize wire length, reduce latency, and improve power efficiency in complex multi-die and chiplet-based designs. The company says its technology can be used independently or integrated with proprietary interconnect solutions to accelerate the design process and time to market.

“We are excited to collaborate and expand our relationship with AMD, a company recognized globally for its innovation in high-performance computing,” said K. Charles Janac, president and CEO of Arteris. “With modern chiplets each having between five and 20 interconnect networks for data transport, our FlexGen NoC IP will work hand in hand with AMD’s Infinity Fabric to accelerate the performance and scalability required by today’s most demanding and diverse applications. This latest engagement with AMD exemplifies the transformative impact of Arteris’ NoC technology in delivering next-generation silicon solutions for a wide range of markets from the data center to the Edge.”

Mydung Pham, corporate vice president, silicon design engineering at AMD, added: “AMD is driving innovations that scale AI from cloud to client by continually developing leadership computing technologies and best-in-class IP. Integrating Arteris’ FlexGen NoC IP technology into a range of AMD chiplets, we can automate interconnect configuration and enable seamless connectivity among SoC components while strengthening the best end-to-end AI compute portfolio in the industry."

DCD took a closer look at the open standard approach to chiplet interconnects, UCIe, in the latest issue of the magazine. You can read about it here.