TSMC signs MoU with SK Hynix for HMB4 production; posts Q1 2024 financial results
Partnership will see SK Hynix adopt TSMC’s foundry processes for next-generation HMB production
News - HBM
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SK Hynix could invest $1bn in advanced chip packaging
Investment will be used to advance power consumption and performance
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SK Hynix to build new packaging plant in Indiana
In 2022, the company pledged to invest $22bn in US-based projects