
Accelsius tests ability to cool 4,500-watt chips
Company deploys demonstration rack at Computacenter site
Company deploys demonstration rack at Computacenter site
Nvidia’s Blackwell currently goes up to 1,200W; Blackwell Ultra set for 1,400W TDP
Cooling company launches suite of services targeting data centers
Available in one or 2MW designs
The new fluid is designed to address the high thermal demands of AI and high-performance computing data centers
Will be deployed at Phoenix and Mount Pleasant facilities from 2026
Company trialing two-phase direct-to-chip and launching field trial data center
Plus a round up of recent cooling news
Built to handle advanced computing applications
Claims to reduce digital infrastructure delivery time by 50 percent
Company increased water use by more than 1 million cubic meters last year
Aims to help companies rightsize cooling unit in direct-to-chip liquid cooling systems
Company to support workloads up to 150kW at 170 locations
Companies to develop direct-to-chip cooling solution
Company brings tech developed by Bell Labs to market
Companies making waterless two-phase, direct-to-chip cooling system with active rear door heat extraction
Companies plan to develop ‘more efficient and reliable’ liquid cooling solutions
DeltaFlow~ designed for high-density workloads up to 300kW
Colo firm aiming to support high-density workloads
Kickstart lets operators try the NeuCool tech in their own facilities
Designed for high-performance servers, will be delivered in 2024
Entering the direct-to-chip cooling market