Connect | APAC // Tech Showcase: Hybrid cooling - Versatility in design for AI data centers | Excool

As the cooling demands for AI infrastructure evolve, so must the solutions and designs to meet them. Excool are showcasing a range of cutting-edge systems and approaches for the modern AI data center, covering:

• Leveraging elevated on-chip temperatures for maximum efficiency, pushing up the amount of power available for revenue-generating IT infrastructure
• Minimising physical cooling plant and supporting infrastructure for a cost-effective build
• Modular, scalable solutions for phased deployment