Cooling is becoming a defining challenge for AI infrastructure. As rack densities rise and deployment timelines accelerate, operators are having to rethink how facilities are designed, delivered, and managed to support the next generation of compute. From modular infrastructure and liquid cooling technologies to the realities of operating high-density environments, each layer plays a critical role in enabling AI workloads at scale.

Join us for this Innovation Day with Schneider Electric to explore how cooling strategies are evolving in practice. Across three sessions, we'll look at how prefabricated infrastructure can accelerate AI-ready deployments, how advanced liquid cooling approaches are supporting higher-density workloads, and what operators are learning from implementing and managing liquid cooling in live environments.