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Liquid cooling continues to evolve as AI infrastructure pushes thermal demands higher. While single-phase systems are becoming more widely adopted, two-phase direct-to-chip cooling is beginning to move into the spotlight. Growing industry testing is providing greater confidence in the performance, efficiency and practical deployment of two-phase direct-to-chip cooling. This episode explores the opportunities two-phase cooling presents, the practical challenges that remain, and where it could fit within the future of AI infrastructure. Join this discussion to explore:

• How two-phase direct-to-chip cooling differs from conventional liquid cooling, including heat transfer basics, piping, charging, commissioning, and ongoing monitoring
• What current testing is revealing about performance, efficiency and reliability
• The role of thermosiphon technology in improving system efficiency
• The impact of refrigerant selection on performance, design and operating conditions