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Data center design is undergoing a fundamental shift from a facility first model to one that starts at the chip and works outward. High density compute is pushing thermal limits, meaning cooling strategies are increasingly shaped by the needs of the silicon itself rather than the constraints of the building. This shift is redefining how infrastructure is designed and deployed, while unlocking new levels of efficiency by bringing cooling closer to the source of heat. This episode will discuss:

• How cooling is shifting closer to the chip, from direct-to-chip to on-chip approaches
• The impact of cooling power-dense chips on server, rack, and wider facility design
• The efficiency gains enabled by chip-first design versus facility-led approaches
• How chip-first approaches vary across hyperscale, enterprise, and colocation environments