This episode is available to stream on-demand.
This episode will explore the leading liquid cooling technologies available in today’s landscape, from rear-door heat exchangers and direct-to-chip. Join this session to gain insights into the strengths and limitations of each approach, highlighting key infrastructure considerations such as chilled water capacity, supply temperature ranges, and delta T. Join this session to better understand how to evaluate liquid cooling options against your unique requirements and prepare your data center to support future innovations that may drive rack densities as high as 250kW. Key discussion points include:
- How to create optimal environments where rear-door heat exchangers can remove essentially 100% of heat generated by IT equipment
- Why direct-to-chip cooling leaves residual cabinet heat to be addressed while scaling up to 120kW
- How to overcome cultural barriers to liquid cooling adoption
