This episode will be available to stream at 12:00 ET

As industry standards race to keep pace with rapidly evolving AI technology, open questions remain and how reliability is defined in the field and tested in the lab continues to evolve. This can leave thermal architects and engineering managers responsible for liquid cooling with uncertainty as to which test data, validation methods, and quick disconnect (QD) innovations meet the threshold for reliability in dense computing environments. Join this episode to discuss:

• An overview of evolving industry standards for quick disconnects
• Insider tips from design engineers on reliability testing QDs to their limits
• A lens to assess new QD innovations such as the UQD08 within this framework
• QD considerations for next-gen applications for future technology roadmaps